The global demand for Thin Wafer Market is presumed to reach the valuation of nearly USD XX MN by 2026 from USD XX MN in 2019 with a CAGR of XX% under the study period of 2020 - 2026.
Thin wafers are semiconductor wafers with a diameter less than the standard thickness. Typically, the thickness of thin wafers is less than 200 μm. The size and thickness alter according to the specific application of the thin wafer. Thin wafers are essential building blocks in semiconductor device manufacturing. They are mainly applicable in devices that require temporary bonding such as LED devices, Radio-frequency devices, and insulated-gate bipolar transistor (IGBT) devices, and advanced packaging solutions. Thin wafers are applicable where the semiconductor device configuration is smaller.
The increased demand from the semiconductors industry is the key factor driving the global thin wafers market. The growing trend for small and portable devices is propelling the global market. The increasing demand for an ultra-thin variety of semiconductors with thickness around 40mm is further supporting the market. The other factors that are contributing to the market include rising adoption of Micro-electromechanical systems (MEMS) technology, increasing the consumer electronics industry, and the growing usage of smartphones. The growth of the thin wafers market is attributed to the increased use of power semiconductor integrated circuits in automotive applications.
The report covers Porter’s Five Forces Model, Market Attractiveness Analysis and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level.
Additionally, these tools also give inclusive assessment of each application/product segment in the global market of thin wafer.
The entire thin wafer market has been sub-categorized into wafer size, process, technology and application. The report provides an analysis of these subsets with respect to the geographical segmentation. This research study will keep marketer informed and helps to identify the target demographics for a product or service.
By Wafer Size
- Temporary Bonding & Debonding
- Carrier-Less/Taiko Process
- RF Devices
This section covers regional segmentation which accentuates on current and future demand for thin wafer market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand for individual application segment across all the prominent regions.
Global Thin Wafer Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the thin wafer market include SK Siltron, Shin-Etsu Chemical Co., Ltd., Siltronic, Sumco Corporation, Globalwafers Co., Ltd., Suss Microtec, Lintec Corporation, Disco Corporation, 3M, Applied Materials. This section includes a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
This market research report has been produced by gathering information on the basis of primary and secondary research. Secondary research has been done by using various sources which include (but not limited to) Company Websites, Paid Data Sources, Technical Journals, Financial Reports, SEC Filings, and other different industry publications.
If specific information is required which is not currently within the scope of the report, it can be provided as a part of customization.