As per this study the Global Solder Materials Market was valued USD XX MN (by revenue) in 2021 and is anticipated to reach USD XX MN by 2028 with a CAGR of XX%.
The solder material is a fusible metal alloy for creating a permanent bond between metal and workpieces. Mainly, it creates connections between components and the printed board. It’s a low cost, highly reliable and easily usable mean for soldering. Some of the solder material are wire, paste, bar, and flux. Moreover, car, machinery, and equipment, ship and building are some of the application areas of solder material.
The rising demand from smart electronics and energy efficient electronics is driving market growth. Growing electronics refurbishing industry in US region along with the rising production of electronics and printed circuit board products is also expected to boost the market growth. In addition to this, extensive R&D for the production of advanced solder materials is further expected to fuel market growth. Furthermore, automation in the soldering techniques with more efficiency is anticipated to augment demand over the forecast period.
This detailed market study is centered on the data obtained from multiple sources and is analyzed using numerous tools including porter’s five forces analysis, market attractiveness analysis and value chain analysis. These tools are employed to gain insights of the potential value of the market facilitating the business strategists with the latest growth opportunities. Additionally, these tools also provide a detailed analysis of each application/product segment in the global market of solder materials.
The broad solder materials market has been sub-grouped into type and application. The report studies these subsets with respect to the geographical segmentation. The strategists can gain a detailed insight and devise appropriate strategies to target specific market. This detail will lead to a focused approach leading to identification of better opportunities.
- Machinery And Equipment
Furthermore, the report comprises of the geographical segmentation which mainly focuses on current and forecast demand for solder materials in North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The report further focuses on demand for individual application segments in all the regions.
Global Solder Materials Market Share by Region (Representative Graph)
The report also covers detailed competitive landscape including company profiles of key players operating in the global market. The key players in the solder materials market include AIM, DS HiMetal, Fusion, Indium, Inventec, KAWADA, Kester, Koki Company, Lucas Milhaupt, Nihon Genma, Qualitek International, Senju Metal Industry, Stannol GmbH & Co. KG, Tamura, The Dow Chemical and Yashida.An in-depth view of the competitive outlook includes future capacities, key mergers & acquisitions, financial overview, partnerships, collaborations, new product launches, new product developments and other developments with information in terms of H.Q.
A combination of primary and secondary research has been used to determine the market estimates and forecasts. Sources used for secondary research include (but not limited to) Paid Data Sources, Company Websites, Technical Journals, Annual Reports, SEC Filings and various other industry publications. Specific details on methodology used for this report can be provided on demand.