The global demand for Radiation Hardened Electronics Market is presumed to reach the market size of nearly USD XX MN by 2028 from USD XX MN in 2021 with a CAGR of XX% under the study period 2022 - 2028.
Radiation hardened electronics refers to electronic components. It consists of circuits, resistors, transistors, capacitors, diodes, single-board computer CPUs, packages, and products primarily used in industries to protect devices from extremely high radiation exposure. The radiation hardened electronics play a crucial role in protecting electronic equipment from physical damage and failure caused by harmful radiation in outer space. They are designed to withstand radiation and extreme temperatures ranging from -55°C to 125°C.
Market Dynamics
The market for radiation hardened electronics is driven by growing demand for communication satellites and increasing surveillance. The increasing number of commercial space programs and growing adoption of electronics radiation exposure systems are other major factors contributing to market growth. Moreover, increased demand for radiation-hardened electronics used in satellites has been driven by rising space exploration programmes and long-distance communication. Other major factors fuelling market growth are various technological advancements, such as developing highly reliable integrated circuits and improving field-programmable gate array (FPGA) technology, which will boost the market. However, the high maintenance cost of radiation hardened electronics may hamper its market growth during the assessment period.
The research report covers Porter’s Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of radiation hardened electronics. The growth and trends of radiation hardened electronics industry provide a holistic approach to this study.
Market Segmentation
This section of the radiation hardened electronics market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.
By Component
- Mixed Signal ICs
- Processors & Controllers
- Memory
- Power Management
By Manufacturing Technique
- Radiation-Hardening by Design (RHBD)
- Radiation-Hardening by Process (RHBP)
By Product Type
- Commercial-off-the-Shelf (COTS)
- Custom Made
By Application
- Space
- Aerospace & Defense
- Nuclear Power Plant
- Medical
- Others
Regional Analysis
This section covers the regional outlook, which accentuates current and future demand for the Radiation Hardened Electronics market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.
Global Radiation Hardened Electronics Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the radiation hardened electronics market include Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
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