The global demand for Non UV Dicing Tapes Market is presumed to reach the valuation of nearly USD XX MN by 2026 from USD XX MN in 2019 with a CAGR of XX% under the study period of 2020 - 2026.
Non-UV Dicing Tapes Non-UV Dicing Tapes are thin adhesive tapes used during wafer fabrication to hold pieces of semiconductor together during cutting. These tapes are generally flexible films made of PVC. These tapes can be easily removed after the completion of the dicing process. The tapes usually made from polymers are very light, highly stable, super flexible, provides a good barrier and is resistant to high pressure The dicing tapes are very sensitive to UV rays and their adhesive properties can alter when exposed.They are available in a broader range of thickness and expandability.
The increase in demand for high-performance electronics gadgets and other semiconductor devices is expected to escalate the demand for non-UV dicing tapes. The reduction in wafer thickness due to technological advancements and growing demand for compact durable electronic products can propel the growth. With the advent of newer technologies like machine learning,artificial intelligence,IoT the need for robust semiconductors is on the rise which can boost the growth of this market at an alarming rate.The main hindering factors to this market are the cost of raw materials, the rate of consumption, high manufacturing costs and highly competitive market players.
The report covers Porter’s Five Forces Model, Market Attractiveness Analysis and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level.
Additionally, these tools also give inclusive assessment of each application/product segment in the global market of non UV dicing tapes.
The entire non UV dicing tapes market has been sub-categorized into material, thickness and application. The report provides an analysis of these subsets with respect to the geographical segmentation. This research study will keep marketer informed and helps to identify the target demographics for a product or service.
- Below 85 Micron
- 85-125 Micron
- 125-150 Micron
- Above 150 Micron
- Wafer Dicing
- Package Dicing
This section covers regional segmentation which accentuates on current and future demand for non UV dicing tapes market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand for individual application segment across all the prominent regions.
Global Non UV Dicing Tapes Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the non UV dicing tapes market include Pantech Tape, Furukawa Electric, Mitsui Chemicals, AI Technology, Lintec Corporation, QES Group Berhad, AMC Co.,Ltd., Airy Technology, Others. This section includes a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
This market research report has been produced by gathering information on the basis of primary and secondary research. Secondary research has been done by using various sources which include (but not limited to) Company Websites, Paid Data Sources, Technical Journals, Financial Reports, SEC Filings, and other different industry publications.
If specific information is required which is not currently within the scope of the report, it can be provided as a part of customization.