The global demand for Low Pressure Molding with Polyamides Market is presumed to reach the valuation of nearly USD XX MN by 2028 from USD XX MN in 2021 with a CAGR of XX% under the study period of 2022 - 2028.
Low-pressure molding with polyamide is used to encapsulate and environmentally protect electronic components against dirt, moisture, dust, and vibration. In this process, hot-melt polyamides are poured into the melt tank, which is connected to the low-pressure molding equipment. Later heating to between 180°C and 210°C, the liquid material is injected into a pre-designed mold set that contains the electronic component or device. Low pressure and heat are applied, after which the electronics are fully encapsulated. This process's benefits are: operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. Materials exhibit exceptional electrical insulation and temperature, vibration, and solvent resistance for many applications.
Market Dynamics
Increasing need to protect electronic devices from moisture, dust, dirt, and vibration drives demand for low-pressure molding with polyamides. Global low-pressure molding with polyamides market will continue to grow as electronic device manufacturers continue to move toward more cost-effective and sustainable solutions. The process is increasingly being chosen as an alternative to potting and encapsulating processes. Today, low-pressure molding with polyamides is used in various applications, protecting the sensitive LED electronics mounted on the bridge from the harsh geographic environment. The process is chosen to preserve electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill. Low-pressure molding with polyamides is also found in these high-visibility applications and products like coffee makers, self-driving cars, GPS tracking devices, and PC accessories. However, the presence of a superior performing process and material is estimated to hamper growth during the forecast period.
The report covers Porter's Five Forces Model, Market Attractiveness Analysis and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level.
Additionally, these tools also give inclusive assessment of each segment in the global market of low pressure molding with polyamides.
Market Segmentation
This section of the low pressure molding with polyamides market report provides detailed data on the segments by analyzing them geographically, thereby assisting the strategist in identifying the target demographics for the respective product or service.
By Type
- Black Type
- Amber Type
- Others
By Application
- Electronics
- Automotive
- Textile Industry
- Others
- Regional Analysis
This section covers regional segmentation which accentuates on current and future demand for Low Pressure Molding with Polyamides market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand for individual application segment across all the prominent regions.
Global Low Pressure Molding with Polyamides Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the low pressure molding with polyamides market include Henkel, Bostik, MoldMan, SUNTIP, Austromelt, Rixin Fine Synthetic Material, Taiyu Alwayseal Technology, KY Chemical. This section includes a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
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