The global demand for Hot-Melt Based Packaging Adhesives Market is presumed to reach the market size of nearly USD XX MN by 2028 from USD XX MN in 2021 with a CAGR of XX% under the study period of 2022 - 2028. Regarding volume, the market was calculated XX Kilo Tons in 2021 and forecast to touch XX Kilo Tons by 2028 with a CAGR of XX% during 2022-2028.
Hot melt packaging adhesives are 100% solid adhesive that melts to the liquid phase on heating and solidifies to form a bond when they cool. HMA can bond various substrates like rubbers, ceramics, metals, plastics, glass, and wood. These adhesives can be used with most machines, materials, and pack formats. They have been specifically engineered, clean-running, and can be accurately applied at high speeds, making them ideal for sealing cartons and cases used for sift-proof detergent, cereal, seed, pet food, and powder packs. They are available in various types and formats, making them ideal for use in a wide range of packaging applications across several industries.
Market Dynamics
The rising need for high standard performing adhesive packaging across various industries is the significant driver for market growth. Food, beverage, pharmaceutical, and packaged goods manufacturers relying on adhesives to enhance their product presentation, differentiate their brands, improve their production line automation and efficiency will benefit market growth. The growing. These adhesives used in healthcare, electronics, and pharmaceutical packaging that need to be secure, tamper-resistant, provide superior pack construction and sealing strength will further propel market growth. Easy application, low cost, long shelf life, few regulations, and low level of volatile organic compounds (VOCs) will be a market booster. The high costs of the adhesives and the application equipment are factors restraining market growth.
The report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of hot-melt based packaging adhesives. The growth and trends of Hot-Melt Based Packaging Adhesives Industry provide a holistic approach to this study.
Market Segmentation
This section of the hot-melt based packaging adhesives market report provides detailed data on the segments by analyzing them at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.
By Resin Type
- Ethylene-vinyl Acetate (EVA)
- Styrenic Block Copolymers
- Metallocene Polyolefin (mPO)
- Polyamide
- Polyolefins
- Amorphous Poly-alphaolefin (APAO)
- Polyurethane (PU) (including reactive HMA)
- Others
By End-Use Industry
- Packaging Solutions
- Nonwoven Hygiene Products
- Furniture & Woodwork
- Bookbinding
- Others
Regional Analysis
This section covers the regional outlook, which accentuates current and future demand for the Hot-Melt Based Packaging Adhesives market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.
Global Hot-Melt Based Packaging Adhesives Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the hot-melt based packaging adhesives market include Henkel AG & Co. KGaA, Arkema Group, H.B. Fuller Company, Dow, Jowat SE, Sika AG, Avery Dennison Corporation, 3M, Ashland, Beardow Adams. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
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