The global demand for Epoxy Molding Compound Market is presumed to reach the market size of nearly USD 3.8 MN by 2030 from USD 2.18 MN in 2022 with a CAGR of 7.2% under the study period 2023 - 2030.
Epoxy moulding compounds are typically solid epoxy polymers that are melted to become a liquid before being released into a shielded cable. It is an encapsulant that is used in the majority of things that contain semiconductors. EMC provides excellent protection to semiconductor circuits from external environmental influences like moisture, heat, and shock. The main components of EMC include epoxy resin, hardener, silica, and other additives. Memory, system LSI, individual devices etc., are examples of its applications.
Market Dynamics
The primary driver of demand for epoxy moulding compounds is the replacement of traditional resin moulding materials. Furthermore, features like heat resistance, flame resistance, high dielectric strength, and corrosion resistance are expected to fuel their adoption and demand, ensuring growth over the years. The rising demand for epoxy moulding compounds in various end-use industries like automotive and aerospace is expected to bolster the market growth.
The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of epoxy molding compound. The growth and trends of epoxy molding compound industry provide a holistic approach to this study.
Market Segmentation
This section of the epoxy molding compound market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.
By Types
- Normal Epoxy Molding Compound
- Green Epoxy Molding Compound
By Applications
- Semiconductor Encapsulation
- Electronic Components
Regional Analysis
This section covers the regional outlook, which accentuates current and future demand for the Epoxy Molding Compound market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.
Global Epoxy Molding Compound Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Epoxy Molding Compound market include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Beijing Sino-tech Electronic Material. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
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