Global Dual or Quad Flat Pack No Lead Package Market Report By Type (<2x2, 2x2 to 3x3, >3x3 to 5x5, >5x5 to 7x7, >7x7 to 9x9, >9x9 to 12x12), By Application (Mobile Communications, Wearables, Industrial, Automotive, Internet of Things) And By Regions - Industry Trends, Size, Share, Growth, Estimation and Forecast, 2020-2027

ID:VMR11216096
September 2021
Report Formats:
The global demand for Dual or Quad Flat Pack No Lead Package Market is presumed to reach the market size of nearly USD XX MN by 2027 from USD XX MN in 2020 with a CAGR of XX% under the study period 2021 - 2027.

Different types of surface-mount IC packages built on a PCB are available. The Quad Flat No-Lead Package (QFN) packages are the most popular of them. It is a tiny, lead-free packaging that provides moderate heat dissipation in PCBs. The function of a QFN package is to connect the IC's silicon die to the circuit board. The QFN packages include a die surrounded by a lead frame. A copper-alloy with a matt tin coating is used for making the lead frame. Consumer, industrial, automotive, and power applications can all benefit from these small packages. They're suitable for applications that need to dissipate heat quickly. 

Market Dynamics

The global quad-flat-no-lead packaging market is expected to proliferate over the years. This expansion can be attributed to increased wireless application reliability, rising portable device adoption, small form factor, good thermal performance, and increased applications in the automotive sector. Furthermore, almost every car manufacturer offers accessories such as keyless locks and unlocking systems for car doors. These devices increase the demand for QFN packages. As a result, vendors have enormous opportunities to offer their offerings in these sectors and invest in product innovation to create more compact and enhanced global quad-flat-no-lead packages. In addition, wearable devices, like personal medical monitoring devices, wristwatches, and others, are small electronic devices widely used by customers, resulting in a demand for packages as small QFN. The above-stated factors substantially contribute to the market's growth. 

The research report covers Porter’s Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of dual or quad flat pack no lead package. The growth and trends of dual or quad flat pack no lead package industry provide a holistic approach to this study. 

Market Segmentation

This section of the dual or quad flat pack no lead package market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities. 

By Type
  • <2X2
  • 2X2 To 3X3
  • >3X3 To 5X5
  • >5X5 To 7X7
  • >7X7 To 9X9
  • >9X9 To 12X12

By Application
  • Mobile Communications
  • Wearables
  • Industrial
  • Automotive
  • Internet Of Things

Regional Analysis

This section covers the regional outlook, which accentuates current and future demand for the Dual or Quad Flat Pack No Lead Package market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

Global Dual or Quad Flat Pack No Lead Package Market Share by Region (Representative Graph)
Global Dual or Quad Flat Pack No Lead Package Market Share


The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the dual or quad flat pack no lead package market include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, and SFA Semicon. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
 
METHODOLOGY:

This market research report has been produced by gathering information based on primary and secondary research. Secondary research has been done using various sources, including (but not limited to) Company Websites, Paid Data Sources, Technical Journals, Financial Reports, SEC Filings, and other different industry publications. Additionally, our team conducts extensive primary research with key industry participants to gather first-hand data. The data is then analyzed and validated by industry experts.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE
       1.1. Report Description
           1.1.1. Objective
           1.1.2. Target Audience
           1.1.3. Unique Selling Proposition (USP) & offerings
       1.2. Research Scope
       1.3. Research Methodology
           1.3.1. Market Research Process
           1.3.2. Market Research Methodology
 
2 . EXECUTIVE SUMMARY
       2.1. Highlights of Market
       2.2. Global Market Snapshot
 
3 . DUAL OR QUAD FLAT PACK NO LEAD PACKAGE – INDUSTRY ANALYSIS
       3.1. Introduction - Market Dynamics
       3.2. Market Drivers
       3.3. Market Restraints
       3.4. Opportunities
       3.5. Industry Trends
       3.6. Porter’s Five Force Analysis
       3.7. Market Attractiveness Analysis
           3.7.1 By Type
           3.7.2 By Application
           3.7.3 By Region
 
4 . VALUE CHAIN ANALYSIS
       4.1. Value Chain Analysis
       4.2. Raw Material Analysis
           4.2.1. List of Raw Materials
           4.2.2. Raw Material Manufactures List
           4.2.3. Price Trend of Key Raw Materials
       4.3. List of Potential Buyers
       4.4. Marketing Channel
           4.4.1. Direct Marketing
           4.4.2. Indirect Marketing
           4.4.3. Marketing Channel Development Trend
 
5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK
       5.1. Impact Analysis of Covid-19 Outbreak
           5.1.1. Direct Impact on Production
           5.1.2. Supply Chain and Market Disruption
           5.1.3. Financial Impact on Firms and Financial Markets
       5.2. COVID-19 Impact Analysis by Production, Import, Export and Demand
       5.3. Market: Pre V/S Post COVID-19
       5.4. Estimated Impact of the Coronavirus (COVID-19) Epidemic
       5.5. COVID-19: Micro and Macro Factor Analysis
 
6 . GLOBAL DUAL OR QUAD FLAT PACK NO LEAD PACKAGE MARKET ANALYSIS BY TYPE
       6.1 Overview by Type
       6.2 Historical and Forecast Data
       6.3 Analysis by Type
       6.4 <2x2 Market by Regions
       6.6 2x2 to 3x3 Market by Regions
       6.5 >3x3 to 5x5 Market by Regions
       6.7 >5x5 to 7x7 Market by Regions
       6.8 >7x7 to 9x9 Market by Regions
       6.9 >9x9 to 12x12 Market by Regions
 
7 . GLOBAL DUAL OR QUAD FLAT PACK NO LEAD PACKAGE MARKET ANALYSIS BY APPLICATION
       7.1 Overview by Application
       7.2 Historical and Forecast Data
       7.3 Analysis by Application
       7.4 Mobile Communications Market by Regions
       7.5 Wearables Market by Regions
       7.6 Industrial Market by Regions
       7.7 Automotive Market by Regions
       7.8 Internet of Things Market by Regions
 
8 . GLOBAL DUAL OR QUAD FLAT PACK NO LEAD PACKAGE MARKET ANALYSIS BY GEOGRAPHY
       8.1. Regional Outlook
       8.2. Introduction
       8.3. North America
           8.3.1. Overview, Historic and Forecast Data
           8.3.2. North America By Segment
           8.3.3. North America By Country
           8.3.4. United State
           8.3.5. Canada
           8.3.6. Mexico
       8.4. Europe
           8.4.1. Overview, Historic and Forecast Data
           8.4.2. Europe by Segment
           8.4.3. Europe by Country
           8.4.4. United Kingdom
           8.4.5. France
           8.4.6. Germany
           8.4.7. Italy
           8.4.8. Russia
           8.4.9. Rest Of Europe
       8.5. Asia Pacific
           8.5.1. Overview, Historic and Forecast Data
           8.5.2. Asia Pacific by Segment
           8.5.3. Asia Pacific by Country
           8.5.4. China
           8.5.5. India
           8.5.6. Japan
           8.5.7. South Korea
           8.5.8. Australia
           8.5.9. Rest Of Asia Pacific
       8.6. Latin America
           8.6.1. Overview, Historic and Forecast Data
           8.6.2. Latin America by Segment
           8.6.3. Latin America by Country
           8.6.4. Brazil
           8.6.5. Argentina
           8.6.6. Peru
           8.6.7. Chile
           8.6.8. Rest of Latin America
       8.7. Middle East & Africa
           8.7.1. Overview, Historic and Forecast Data
           8.7.2. Middle East & Africa by Segment
           8.7.3. Middle East & Africa by Country
           8.7.4. Saudi Arabia
           8.7.5. UAE
           8.7.6. Israel
           8.7.7. South Africa
           8.7.8. Rest Of Middle East And Africa
 
9 . COMPETITIVE LANDSCAPE OF THE DUAL OR QUAD FLAT PACK NO LEAD PACKAGE COMPANIES
       9.1. Dual or Quad Flat Pack No Lead Package Market Competition
       9.2. Partnership/Collaboration/Agreement
       9.3. Merger And Acquisitions
       9.4. New Product Launch
       9.5. Other Developments
 
10 . COMPANY PROFILES OF DUAL OR QUAD FLAT PACK NO LEAD PACKAGE INDUSTRY
       10.1. Company Share Analysis
       10.2. Market Concentration Rate
       10.3. ASE(SPIL)
           10.3.1. Company Overview
           10.3.2. Financials
           10.3.3. Products
           10.3.4. Recent Developments
       10.4. Amkor Technology
           10.4.1. Company Overview
           10.4.2. Financials
           10.4.3. Products
           10.4.4. Recent Developments
       10.5. JCET Group
           10.5.1. Company Overview
           10.5.2. Financials
           10.5.3. Products
           10.5.4. Recent Developments
       10.6. Powertech Technology Inc.
           10.6.1. Company Overview
           10.6.2. Financials
           10.6.3. Products
           10.6.4. Recent Developments
       10.7. Tongfu Microelectronics
           10.7.1. Company Overview
           10.7.2. Financials
           10.7.3. Products
           10.7.4. Recent Developments
       10.8. Tianshui Huatian Technology
           10.8.1. Company Overview
           10.8.2. Financials
           10.8.3. Products
           10.8.4. Recent Developments
       10.9. UTAC
           10.9.1. Company Overview
           10.9.2. Financials
           10.9.3. Products
           10.9.4. Recent Developments
       10.10. Orient Semiconductor
           10.10.1. Company Overview
           10.10.2. Financials
           10.10.3. Products
           10.10.4. Recent Developments
       10.11. ChipMOS
           10.11.1. Company Overview
           10.11.2. Financials
           10.11.3. Products
           10.11.4. Recent Developments
       10.12. King Yuan Electronics
           10.12.1. Company Overview
           10.12.2. Financials
           10.12.3. Products
           10.12.4. Recent Developments
       10.13. SFA Semicon
           10.13.1. Company Overview
           10.13.2. Financials
           10.13.3. Products
           10.13.4. Recent Developments
 
 *Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies
 
LIST OF TABLES

  • Market Snapshot
  • Drivers : Impact Analysis
  • Restraints : Impact Analysis
  • List of Raw Material
  • List of Raw Material Manufactures
  • List of Potential Buyers
  • COVID-19 Impact Analysis by Production, Import, Export and Demand
  • Pre V/S Post COVID-19
  • Estimated Impact Of The Coronavirus (Covid-19) Epidemic
  • COVID-19: Micro and Macro Factor Analysis
  • Analysis by Type  (USD MN)
  • <2x2 Market by Geography (USD MN)
  • 2x2 to 3x3 Market by Geography (USD MN)
  • >3x3 to 5x5 Market by Geography (USD MN)
  • >5x5 to 7x7 Market by Geography (USD MN)
  • >7x7 to 9x9 Market by Geography (USD MN)
  • >9x9 to 12x12 Market by Geography (USD MN)
  • Analysis Market by Application  (USD MN)
  • Mobile Communications Market by Geography (USD MN)
  • Wearables Market by Geography (USD MN)
  • Industrial Market by Geography (USD MN)
  • Automotive Market by Geography (USD MN)
  • Internet of Things Market by Geography (USD MN)
  • Global Dual or Quad Flat Pack No Lead Package Market by Geography (USD MN)
  • North America Market Analysis (USD MN)
  • United State Market Analysis (USD MN)
  • Canada Market Analysis (USD MN)
  • Mexico Market Analysis (USD MN)
  • Europe Market Analysis (USD MN)
  • Europe Market Estimate by Country (USD MN)
  • United Kingdom Market Analysis (USD MN)
  • France Market Analysis (USD MN)
  • Germany Market Analysis (USD MN)
  • Italy Market Analysis (USD MN)
  • Russia Market Analysis (USD MN)
  • Spain Market Analysis (USD MN)
  • Rest of Europe Market Analysis (USD MN)
  • Asia Pacific Market Analysis (USD MN)
  • China Market Analysis (USD MN)
  • Japan Market Analysis (USD MN)
  • India Market Analysis (USD MN)
  • South Korea Market Analysis (USD MN)
  • Australia Market Analysis (USD MN)
  • Rest of Asia Pacific Market Analysis (USD MN)
  • Latin America Market Analysis (USD MN)
  • Brazil Market Analysis (USD MN)
  • Argentina Market Analysis (USD MN)
  • Peru Market Analysis (USD MN)
  • Chile Market Analysis (USD MN)
  • Rest of Latin America Market Analysis (USD MN)
  • Middle East & Africa Market Analysis (USD MN)
  • Saudi Arabia Market Analysis (USD MN)
  • UAE Market Analysis (USD MN)
  • Israel Market Analysis (USD MN)
  • South Africa Market Analysis (USD MN)
  • Rest of Middle East and Africa Market Analysis (USD MN)
  • Partnership/Collaboration/Agreement
  • Mergers And Acquisiton
 
LIST OF FIGURES
 
  • Research Scope of Dual or Quad Flat Pack No Lead Package Report
  • Market Research Process
  • Market Research Methodology
  • Global Dual or Quad Flat Pack No Lead Package Market Size, by Region (USD MN)
  • Porters Five Forces Analysis
  • Market Attractiveness Analysis by Type
  • Market Attractiveness Analysis by Application
  • Market Attractiveness Analysis by Region
  • Value Chain Analysis
  • Global Market Analysis by Type  (USD MN)
  • <2x2 Market by Geography (USD MN)
  • 2x2 to 3x3 Market by Geography (USD MN)
  • >3x3 to 5x5 Market by Geography (USD MN)
  • >5x5 to 7x7 Market by Geography (USD MN)
  • >7x7 to 9x9 Market by Geography (USD MN)
  • >9x9 to 12x12 Market by Geography (USD MN)
  • Global Market Analysis by Application  (USD MN)
  • Mobile Communications Market by Geography (USD MN)
  • Wearables Market by Geography (USD MN)
  • Industrial Market by Geography (USD MN)
  • Automotive Market by Geography (USD MN)
  • Internet of Things Market by Geography (USD MN)
  • Global Market by Revenue
  • North America Market by Revenue
  • Europe Market by Revenue
  • Asia Pacific Market by Revenue
  • Latin America Market by Revenue
  • Middle East & Africa Market by Revenue
  • Recent Development in Industry
  • Company Market Share Analysis, 2020
 
* Kindly note that the above listed are the basic tables and figures of the report and are not limited to the TOC.

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  • Analyze competitive developments

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