The global demand for Chemical Mechanical Planarization Market is presumed to reach the valuation of nearly USD XX MN by 2028 from USD XX MN in 2021 with a CAGR of XX% during the period of 2022-2028.
Chemical Mechanical Planarization or CMP is a fabrication technique which combines both chemical and mechanical processes to polish silicon surfaces by removing slurries. CMP is carried out in the final stages of semiconductor manufacturing to polish the wafers. It has become an indispensable part of wafer and semiconductor manufacturing. To achieve planarity a combination of abrasion and oxidation processes are used to remove unwanted material on the surface. This critical process in any chip manufacture is being used on emerging structures of 3D memory. This process employs a slurry, a polishing pad and a retaining ring.
The main driver for the growth of the CMP market is the semiconductor manufacturing sector which is expanding at an unprecedented pace. Emerging new smart technologies and consumer products for use across various domains will boost the growth of this market. The innovations in material science like the use of microlens arrays in LEDs has accelerated the demand for CMP in non-, semiconductor applications. The growing need for scalable 3D memory architecture will greatly benefit the market. This technology will continue to grow post-COVID-19 lockdown since semiconductors have become an integral part of our day to day activities. CMP process has limitations like corrosion and stress cracking due to slurries which can hamper the growth of this market.
The report covers Porter’s Five Forces Model, Market Attractiveness Analysis and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level.
Additionally, these tools also give inclusive assessment of each application/product segment in the global market of chemical mechanical planarization.
The entire chemical mechanical planarization market has been sub-categorized into type and application. The report provides an analysis of these subsets with respect to the geographical segmentation. This research study will keep marketer informed and helps to identify the target demographics for a product or service.
- CMP Equipment
- CMP Consumables
- Integrated Circuits
- Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS)
- Compound Semiconductors
This section covers regional segmentation which accentuates on current and future demand for chemical mechanical planarization market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand for individual application segment across all the prominent regions.
Global Chemical Mechanical Planarization Market Share by Region (Representative Graph)
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the chemical mechanical planarization market include Applied Materials, Inc., Strasbaugh Inc., LapmasterWolters GmbH, LAM Research Corporation, Cabot Microelectronics Corporation, Fujimi Incorporated, Air Products & Chemicals Inc., Hitachi Chemical Company Ltd., Ebara Corporation, Okamoto Machine Tool Works Ltd., DOW Electronic Materials. This section includes a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
This market research report has been produced by gathering information on the basis of primary and secondary research. Secondary research has been done by using various sources which include (but not limited to) Company Websites, Paid Data Sources, Technical Journals, Financial Reports, SEC Filings, and other different industry publications.
If specific information is required which is not currently within the scope of the report, it can be provided as a part of customization.