Global Printed Circuit Board And Printed Circuit Board Assembly Market To Achieve USD 76 BN By 2026
Posted On December 17, 2019
The Global Printed Circuit Board And Printed Circuit Board Assembly Market report published by Value Market stated that the market was valued USD 64.9 BN in 2019 and is anticipated to reach USD 76 BN by 2026 with a CAGR of 2.3% within the forecasted period from 2020 to 2026. The upsurge in demand for consumer electronics, smartphones and other such wearable gadgets has majorly driven the market growth. The thriving high density interconnect technology along with miniaturization of electronic devices has again led to the growth of the printed circuit board and printed circuit board assembly market globally. Also, the launch of newer, advanced and greener material to obtain the energy-intensive manufacturing process have further contributed to the growth of the market.
The printed circuit board refers to the board that mechanically supports and electrically connects the components within the electronic devices. It connects the different components by using pads and conductive tracks that are carved from copper laminated sheets onto a non-conductive substrate. The printed circuit board assembly is a board that is equipped with all the essential components and parts installed and soldered over PCB. The main benefit of a PCB is that while it avoids short-circuiting and the problem of tangling of wires, it also makes a wide circuit network very compact and easy to monitor and mount. To position the electronic components in an insulated board, holes are created with the help of drillers. To maintain the stability of the component in a circuit board, the components are soldered on the board and are then connected through copper tracks.
The report “Global Printed Circuit Board And Printed Circuit Board Assembly Market Report By Product (Rigid 1-2 Sided, Standard Multilayer, HDI/Microvia/Build Up, IC Substrate, Flexible Circuit, Rigid Flex And Others), By Application (Consumer Electronics, Computer, Communication, Industrial/Medical, Automotive, Military/Aerospace And Others) And By Regions - Industry Trends, Size, Share, Growth, Estimation And Forecast, 2019-2026” covers the market analysis, market dynamics and a detailed description of the competitive landscape of the printed circuit board and printed circuit board assembly market.
By product, the segments of the global printed circuit board and printed circuit board assembly market are ring 1-2 sided, standard multilayer, HDI/Microvia/Build-Up, IC substrate, flexible circuit and rigid-flex.
By application, consumer electronics, computer, communication, industrial/medical, automotive and military/aerospace are the segments of the global printed circuit board and printed circuit board assembly where consumer electronics have led this segment.
North America, Europe, Asia Pacific, Latin America and Middle East & Africa are the geographical segments of the global printed circuit board and printed circuit board assembly market. Asia Pacific has been identified as the leading segment as per the report. The factors such as the growth of the major end-user segments such as telecommunications, consumer electronics, and automotive industries and the increased application of connectors in the defense and medical sector led to the growth of this region.
The Report Segments Global Printed Circuit Board And Printed Circuit Board Assembly Market -
- Rigid 1-2 Sided
- Standard Multilayer
- HDI/Microvia/Build Up
- IC Substrate
- Flexible Circuit
- Rigid Flex
- Consumer Electronics
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
Players Profiled In the Report:
Nippon Mektron, Unimicron, SEMCO, Young Poong Group, Ibiden, ZDT, Tripod, TTM, SEI, Daeduck Group, HannStar Board (GBM), Viasystems, Nanya PCB, CMK Corporation, Shinko Electric Ind, Compeq, AT&S, Kingboard, Ellington, Fengshun Junda Electronic Co.,Ltd., CCTC, Redboard, Wuzhou Group, Kinwong, Aoshikang and Shennan Circuits
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